20212022202320242025(Year)Demand for semiconductors grew rapidly owing to such factors as the proliferation of teleworking, which became more entrenched as a result of COVID-19. Demand slowed until the first half of 2023 in reaction to a spike in pandemic-era demand and inventory adjustments, but is showing signs of recovery from 2024 onward, driven by the boom in genera-tive AI. In June, World Semiconductor Trade Statistics, which consists of major semiconductor manufacturers, forecast that the global semiconductor market would expand to US$611.2 billion in 2024, up 16.0% from the previous year. Corroborating this forecast, semiconductor manufacturers are accelerating their investments. Meanwhile, Japanese companies, which have a high share of the global markets for semiconductor production equipment and semiconductor materials, are attracting a great deal of attention.In September 2023, we moved into the the Research Center for Three-Dimensional Semiconductors, operated by the Fukuoka Industry, Science & Technology Promotion Foundation, and established the Package and Material Development Group as a new R&D organization within the center. The semiconductor manufacturing process is broadly divided into the front-end process of forming circuits on wafers and the back-end process, which includes cutting wafers into chips, wiring them, and assembling them into elec-tronic components. As chip miniaturization approaches its physical limits, technological innovations related to the back-end process, such as stacking multiple chips in three-dimensional packaging, are thought to be the key to achieving even higher semiconductor performance. The center is equipped with a variety of research facilities and has built an integrated development system that can handle everything from design to proto-typing, evaluation, and analysis. Several members of our technical staff are stationed at the Package and Material Development Group. We will promote the development of new tapes, equipment, and proprietary processes related to packaging technology in advanced semiconductor back-end processing, such as three-dimensional packag-ing, by effectively utilizing the various facilities and technological capabilities of the Research Center for Three-Dimensional Semiconductors. Going forward, we will consider strengthening our development system by increasing the number of resi-dent staff and by working more closely with our research laboratories in the cities of Warabi and Saitama, Saitama Prefecture. Source: World Semiconductor Trade Statistics Semiconductor Market ForecastUS$ Billion8006004002000Research Center for Three-Dimensional Semiconductors (Fukuoka Prefecture)34The semiconductor-related market has been growing vigorously, buoyed by advances in digitalization. The momentum continues, and demand for semiconductors and electronic components is expected to remain firm due to increasingly high-performance smartphones, PCs, and other electronic devices; the spread of electric vehicles; and the expansion of the generative AI. Our Advanced Materials Operations offer a variety of products, such as semiconductor-related adhesive tapes and equipment and multilayer ceramic capacitor-related tapes, that play a role in our increasingly sophisticated digital society. This section describes the Group’s electronics-related products and recent measures to capture growth markets.Medium-Term Strategies574.1555.9526.9687.4611.2(Forecast)(Forecast)Expansion in Semiconductor-Related MarketsStrengthening of the Development of New Products and Proprietary Processes Related to Advanced Semiconductor Back-End ProcessesSemiconductor-Related BusinessContributing to an Increasingly Sophisticated Digital SocietySPECIAL FEATURE
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