202220232024(Forecast)67.461.561.2080604020202132Value Creation StrategyBusiness Strategy• Develop thin-film, high-density, multilayer products for next-generation device manufacturing processes• Develop adhesive tape for semiconductor processes used in power devices for automobiles and MEMS (microelectrome-chanical systems)• Launch carbon nanotube products55.3Net Sales: Advanced Materials OperationsLSV 2030-Stage 1¥ BillionBusiness Operations IntroductionWe are building a unique position in the electronics industry, which is expected to continue to record substantial growth. Our products include a variety of specialized adhesive tape that plays an important role in semiconductor manufacturing and mounting processes, and we also make equipment that fully leverages the special features of this tape. In addition, we produce and sell release film that is crucial in the production of multilayer ceramic capacitors.Main Initiatives in Medium-term Business Plan LSV 2030-Stage 1• Expand market share of semiconductor- and electronic component-related products through active investment(Fiscal years ended / ending March 31)A Message from the Executive General Manager, Advanced Materials OperationsDuring the fiscal year ended March 31, 2023, the easing of pandemic-era demand and an economic downturn in China prompted by the country’s zero-COVID policy, as well as global inflationary pressures due to geopolitical issues, prompted a decline in consumer sentiment. This led to a slump in the overall electronics market, includ-ing demand for smartphones and PCs, as well as auto-motive and industrial applications. Despite the positive impact of the rapid depreciation of the yen on this busi-ness, sales were down year on year. Despite the difficult business environment, we are preparing for a recovery in the electronics market and renewed growth in demand for our products. In terms of capital expenditures, we finished installing a machine to produce multilayer ceramic capacitor-related tape in March 2023. We plan to add one more unit this fiscal year and another two during the fiscal year ending March 31, 2025. Additionally, the installation of new production equipment for semiconductor-related adhe-sive tape is scheduled for completion in early 2024. In addition to enhancing our production capacity, we will focus on streamlining operations at our operating sites around the world and adapting to the changing supply chain. We aim to quickly commercialize new products involving pellicles for extreme ultraviolet (EUV) lithogra-phy systems, which form the fine electronic circuits.Advanced Materials OperationsKinya MochidaManaging Executive OfficerDeputy Executive General Manager, Business Administration Div., and Executive General Manager, Advanced Materials OperationsElectronic and Optical Products
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