23Adhesive sheets that are melted using high fre-quencies to bond dissimilar materialsKoamamo mixed paper has a unique textureHigh-Frequency Dielectric Heating Adhesive FilmThese adhesive sheets, which melt when exposed to high frequen-cies, can bond different materials such as glass and resin. While offering the same bonding strength as conventional liquid adhe-sives, the sheets reduce working time. Also, another application of high-frequency waves nullifies the adhesion, facilitating disman-tling. We believe these sheets can be used on components to facilitate the recycling of automotive parts. Blend Paper Using KoamamoWe have succeeded in producing paper by blending a type of sea-weed, koamamo (Japanese eelgrass), with wood pulp. Koamamo is found throughout Japan and is recognized for its role in CO2 absorption. However, the seaweed is sometimes removed and discarded to protect the habitat of baby clams and secure fishing routes for fishermen. Using koamamo as a resource could contrib-ute to waste reduction and foster “decarbonization of the sea.” A Message from the General Manager, New Project Planning OfficeThe main mission of this office is creating new products and businesses, which the Company has identified as a key initiative in its long-term vision. To achieve this, we have envisioned our ideal state for 2030 and selected development themes aimed at solving societal and environmental issues. Last year, we launched the purpose brand Welsurt and have been strengthening our technological development and product proposals. In our development efforts, we believe it is crucial to leverage the technology and manufacturing processes we have cultivated to establish a market position distinct to LINTEC. For example, various companies have entered the market for Peltier modules. However, we have used our sheeting technol- ogy, which we have refined over the years, to develop a flexible module that is thinner and lighter than conventional products. As a result, we will expand applications into the area of wearable devices. Also, we are using our proprietary technologies to make steady inroads in the development of promising new products, such as pellicles for extreme ultraviolet (EUV) lithography systems. This particular product is aimed at the “front-end process” domain, which is a segment of the semiconductor industry we have not yet entered. Moving forward, we will continue to boldly take on challenges in new markets and technological areas outside our conventional domains, in an effort to create new value to solve social issues. Takeshi SegawaGeneral Manager, New Project Planning Office, Business Administration Div.
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